The report “Thermal Interface Materials Market by Chemistry (Silicone, Epoxy, Polyimide), Type (Greases & adhesives, Tapes & Films, Gap Fillers), Application (Computers, Telecom, Consumer Durables, Medical Devices) and Region – Global Forecast to 2027”, The global thermal interface materials market size is estimated to be USD 3.4 billion in 2022 and projected to reach USD 5.6 billion by 2027, at a CAGR of 10.5% during the forecast period. The market for thermal interface materials has experienced significant growth, primarily due to growing need of thermal management solutions in ever-shrinking electronic components and systems.
• 205 Market data Tables
• 49 Figures
• 208 Pages and in-depth TOC on “Thermal Interface Materials Market – Global Forecast to 2027”
Some of the prominent key players are:
· Honeywell International Inc. (US)
· 3M (US)
· Henkel AG & Co. KGaA (Germany)
· Parker Hannifin Corporation (US)
· Dow (US)
· Laird Technologies Inc. (US)
· Momentive (US)
· Indim Corporation (US)
· Wakefield Thermal Inc. (US)
· Zalma Tech Co. Ltd. (South Korea)
Opportunity: High-performance thermal interface materials in the form of nanodiamonds
TIMs connect the two surfaces involved in heat transfer, filling the cavity between them and forcing out air. The most common TIMs are metal oxides, ceramics, and silver powders, as they are good conductors of heat. Ray Techniques Ltd, an Israeli company, has recently developed nanodiamonds-based TIMs with a very high level of heat dissipation capability while maintaining a low dielectric constant. Nanodiamonds, with a grain size of 4 nm to 5 nm, are highly efficient fillers in thermal conductive adhesives, as they have high thermal conductivity and insulating properties. Ray Techniques Ltd has developed an innovative technology for nanodiamonds manufacturing known as laser ablation. The nanodiamonds obtained by this technology have high purity and homogeneity. This, along with surface modification of nanodiamonds, allows the nanodiamonds to form covalent bonds with silicon oil molecules. This compound is then incorporated into thermal conducting adhesives. The use of nanodiamonds in TIMs allows researchers to overcome the heat-dissipating limitation of currently available materials, thus making way for faster semiconductors that can run at higher clock speed for a longer duration.
Computers is the largest application segment in the thermal interface materials market during the forecast period.
Computers accounts for largest market share among all applications in thermal interface materials market. This is due to the rapid adoption of computers in various industries such as communication, education, utility facilities, health care, and others coupled with need of durable, long-life, and efficient electronic devices.
APAC is the largest regional market for thermal interface materials during the forecast period.
APAC accounts for largest market share among all the regions in the thermal interface materials market. Rapid adoption of electronic devices in growing economies and increasing consmer spending in region has played a important role in its large market share. Moreover, growing population, growing internet user base, rising per-capita income, rapid industrialization, and development of end-use industries has contributed to the increasing demand for thermal interface materials in the region.
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